53 lines
3.1 KiB
Plaintext
53 lines
3.1 KiB
Plaintext
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(module HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm_LargeCopper (layer F.Cu) (tedit 59EC7C90)
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(descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, with enlarged copper area, see http://www.ti.com/lit/ds/symlink/tps5430.pdf")
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(tags "HTSOP 1.27")
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(attr smd)
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(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm_LargeCopper (at 0 3.5) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.9 0.9) (thickness 0.135)))
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)
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(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
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(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
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(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
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(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
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(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
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(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15))
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(pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers F.Cu))
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(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at 0.6 0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at 0.6 -0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at -0.6 0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at -0.6 -0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(model ${KISYS3DMOD}/Housings_SOIC.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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