RCEU2364-C128-64KB-VRAM/Schematic/C128-VRAM-64K-Expansion.pretty/DIL18.kicad_mod

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2021-04-20 06:38:46 +00:00
(module DIL18 (layer F.Cu) (tedit 0)
(descr "<b>Dual In Line Package</b>")
(fp_text reference IC4 (at -11.684 3.048 -270) (layer F.SilkS)
(effects (font (size 1.2065 1.2065) (thickness 0.12065)) (justify left bottom))
)
(fp_text value "" (at -9.525 0.635 -180) (layer F.Fab)
(effects (font (size 1.2065 1.2065) (thickness 0.12065)) (justify left bottom))
)
(fp_line (start 11.43 -2.921) (end -11.43 -2.921) (layer F.SilkS) (width 0.1524))
(fp_line (start -11.43 2.921) (end 11.43 2.921) (layer F.SilkS) (width 0.1524))
(fp_line (start 11.43 -2.921) (end 11.43 2.921) (layer F.SilkS) (width 0.1524))
(fp_line (start -11.43 -2.921) (end -11.43 -1.016) (layer F.SilkS) (width 0.1524))
(fp_line (start -11.43 2.921) (end -11.43 1.016) (layer F.SilkS) (width 0.1524))
(fp_arc (start -11.43 0) (end -11.43 -1.016) (angle 180) (layer F.SilkS) (width 0.1524))
(pad 1 thru_hole oval (at -10.16 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 2 thru_hole oval (at -7.62 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 7 thru_hole oval (at 5.08 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 8 thru_hole oval (at 7.62 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 3 thru_hole oval (at -5.08 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 4 thru_hole oval (at -2.54 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 6 thru_hole oval (at 2.54 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 5 thru_hole oval (at 0 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 9 thru_hole oval (at 10.16 3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 10 thru_hole oval (at 10.16 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 11 thru_hole oval (at 7.62 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 12 thru_hole oval (at 5.08 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 13 thru_hole oval (at 2.54 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 14 thru_hole oval (at 0 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 15 thru_hole oval (at -2.54 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 16 thru_hole oval (at -5.08 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 17 thru_hole oval (at -7.62 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
(pad 18 thru_hole oval (at -10.16 -3.81 90) (size 2.6416 1.3208) (drill 0.8128) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016))
)